ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,870, issued on Nov. 3, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device" was invented by Syu-... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,871, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Nara Le... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,873, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Hiroto Sakai (Kyoto, Japan), Yut... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,874, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Wonjung... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,875, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Dongkyu... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,876, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display module including bonding member connec... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,877, issued on Nov. 3, was assigned to XIAMEN EXTREMELY PQ DISPLAY TECHNOLOGY Co. LTD. (Xiamen, China). "Micro light emitting diode chip and... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,878, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Stacked integrated circuit devices" was invented by Yue Li (San Diego), R... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,879, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor chip and semiconductor packag... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,880, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Dual-side bridge chips connecting two semicond... Read More